Product
Double-Pulse Test Solutions
Electrical Characteristics
Providing comprehensive testing solutions for power semiconductor devices (IGBT, SiC, GaN), from R&D to application-end.
Automated Test Equipment
Electrical Characteristics
Providing end-to-end, high-volume manufacturing screening test solutions for power semiconductors across Device, DBC, Die, and Wafer levels.
Dynamic Bias Reliability Test Solutions
Reliability
Delivering solutions for SiC device dynamic bias reliability testing in compliance with AQG 324 standard.
Wafer-Level Burn-In Test Solutions
Reliability
Providing fully automated SiC wafer-level burn-in (WLBI) testing solutions for both 6-inch and 8-inch wafers.
Latest News
Firstack Wraps Up Successful Exhibition at PCIM Europe 2026
2026-06-12
Firstack proudly concluded its participation at PCIM Europe 2026
SEMICON SEA 2026 Concludes Successfully | From Lab to Mass Production, From Devices to Wafers: Building Reliable Connections for Power Semiconductors and Systems
2026-05-07
From May 5 to 7, FIRSTACK will participate in SEMICON Southeast Asia 2026, a major semiconductor industry event in Asia, to discuss trends in power device testing and reliability verification with pow...
Firstack Honored with Sungrow’s 2025 “Outstanding Partner”
2026-01-23
We are honored to be awarded the “Outstanding Partner” by Sungrow at SGPC’2026.
Exhibition Review | Firstack one-stop power semiconductor testing solution made a strong debut
2026-03-27
SEMICON China & Productronica China
Technical Articles
11
2026.02
From Theory to Practice: A Guide to Double Pulse Test Capacitor Design for Power Engineers
07
2026.04
Breaking Through Traditional Testing Bottlenecks! A New Solution for Dynamic Testing of 3-Level Devices
04
2024.07
A Brief Discussion on Reliability Testing of Dynamic Bias in SiC Power Devices